December 26, 2024 - 12:03

TSMC’s 2nm technology is not expected to be adopted by Apple’s iPhones before 2026 due to an incredibly low monthly production wafer count. This delay comes as Apple continues to evaluate its supply chain and production capabilities. The anticipated rollout of this advanced technology was initially expected to enhance the performance and efficiency of future iPhone models. However, the current production limitations have prompted Apple to reconsider its timeline.
Industry experts suggest that TSMC is working diligently to ramp up its manufacturing capacity, with projections indicating that wafer capacity could increase by as much as eight times by 2026. This increase could potentially allow Apple to incorporate the cutting-edge technology into its devices, offering significant improvements in processing power and energy efficiency. Until then, Apple will likely continue utilizing existing chip technologies to meet consumer demands and maintain its competitive edge in the smartphone market.
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Cambridge Surveillance Technology Resident Assembly Considers ShotSpotter and Security Cameras in Second MeetingThe Cambridge Surveillance Technology Resident Assembly convened for its second meeting to discuss the implications of ShotSpotter technology and security cameras in the city. Residents expressed a...
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Celebrating 50 Years of Innovation in Sound and TechnologyNow marking half a century of excellence, the company showcases the seamless integration of invisible technology, sensory design, and artificial intelligence into everyday living. This milestone...
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Marvell Technology Shares Drop Amid Acquisition NewsInvestors are feeling jittery as they pull back from AI-related stocks, and Marvell Technology is no exception. The company`s shares took a significant hit this October following the announcement...
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Taiwanese wireless communications company Climax Technology's 3Q26 margins hit by memory, component costsWireless communications company Climax Technology`s third-quarter 2026 gross margin faced significant challenges due to escalating memory and key component costs. The situation was further...